| PART |
Description |
Maker |
| WS128K32N-55G2TCE WS128K32N-55G2TME WS128K32N-55G2 |
128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68
128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT
|
WHITE ELECTRONIC DESIGNS CORP
http://
White Electronic Design...
|
| MF3128-MLDAP01 MF3256-MLDAP01 MF3512-MLDAP01 |
128K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA60
256K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA60
512K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA60
|
|
| IDT7MP1021S65M |
128K X 8 MULTI-PORT DEVICE SRAM MODULE, 65 ns, SMA64
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| DPS128X16AA3-35C DPS128X16AA3-45I DPS128X16AA3-45M |
128K X 16 MULTI DEVICE SRAM MODULE, 35 ns, CPGA50 STACK, CERAMIC, PGA-50
128K X 16 MULTI DEVICE SRAM MODULE, 45 ns, CPGA50 STACK, CERAMIC, PGA-50
|
Twilight Technology, Inc.
|
| WS128K32NV-17H1MA WS128K32NV-17H1C WS128K32NV-17H1 |
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp.
White Electronic Designs, Corp.
|
| EDI8C32128C WS128K32-XXX EDI8C32128LP17EI |
128Kx32 SRAM Module(低功耗CMOS12Kx32静态RAM模块（存取时5705555ns
128Kx32 SRAM Module(低功耗CMOS28Kx32静态RAM模块（存取时5705555ns
128Kx32 SRAM Module(低功耗CMOS12Kx32静态RAM模块（存取时57055555ns
128Kx32 SRAM Module(低功耗CMOS28Kx32静态RAM模块（存取时57205555ns 128Kx32 SRAM的模块（低功耗的CMOS28Kx32静态内存模块（存取时间15,17,20,25,35,45,55纳秒））
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
|
White Electronic Designs Corporation
TE Connectivity, Ltd.
|
| SYS321000LK-012 SYS321000LK-015 SYS321000ZK-015 SY |
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZIP72 PLASTIC, ZIP-72
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZIP72 PLASTIC, ZIP-72
x32 SRAM Module X32号的SRAM模块
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PZIP72 PLASTIC, ZIP-72
|
Sumida, Corp.
TE Connectivity, Ltd.
|
| PUMA68SV32000BM-020 PUMA68SV32000BI-015 |
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PQCC68 25.27 X 25.27 MM, 5.08 MM HEIGHT, PLASTIC, LCC-68
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PQCC68
|
ST Microelectronics
|
| PUMA67S4000M-020 PUMA67S4000M-35 PUMA2S4000M-020 P |
SRAM|128KX32|CMOS|LDCC|68PIN|CERAMIC
2NS, 352 BGA, COM TEMP(FPGA)
SRAM|128KX32|CMOS|PGA|66PIN|CERAMIC
10 MHZ, 3.3V, 44 PLCC, IND TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA) 静态存储器| 128KX32 |的CMOS |美巡赛| 66PIN |陶瓷
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQMA68
|
NIC Components, Corp.
|
| MT2LSYT3272B2G-12L MT4LSYT6472B2G-12L |
32K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160
64K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160
|
RECOM Electronic GmbH
|
|
